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Home Tech News

Apple Signs $30 Billion Chip Deal with Broadcom to Manufacture More Than 15 Billion U.S.-Made Chips

Aya Zhang by Aya Zhang
July 9, 2026
in Tech News, Business

Apple has announced a new multiyear agreement with Broadcom that will see the two companies collaborate on the design and production of custom silicon components and advanced wireless connectivity technologies for a broad range of Apple products. The partnership, valued at more than $30 billion, marks one of Apple’s largest investments in U.S.-based manufacturing and reinforces its long-term strategy to expand domestic semiconductor production.

Under the agreement, Broadcom will manufacture more than 15 billion chips in the United States, supporting hundreds of high-skilled American jobs while strengthening the country’s end-to-end silicon supply chain. The investment builds on Apple’s broader efforts to work alongside the U.S. government and domestic industry partners to increase semiconductor manufacturing capacity and reduce reliance on overseas production.

The collaboration will focus on developing next-generation custom silicon components and cutting-edge wireless connectivity technologies that are critical to the performance, efficiency and reliability of Apple’s ecosystem of devices. The chips will be manufactured at Broadcom’s facilities in Fort Collins, Colorado, where the company has continued to expand its advanced semiconductor capabilities.

Apple Chief Executive Officer Tim Cook

Apple Chief Executive Officer Tim Cook said the agreement represents the next chapter in the companies’ longstanding partnership and reflects Apple’s continued commitment to American manufacturing, innovation and technology leadership.

Cook noted that the advanced components produced in Fort Collins will play a vital role in delivering the high levels of performance and connectivity expected across Apple’s products. He added that the company remains committed to investing in U.S.-based suppliers that share its focus on innovation, quality and operational excellence, while acknowledging the support of the U.S. administration for initiatives aimed at strengthening domestic manufacturing.

Broadcom President and Chief Executive Officer Hock Tan

Broadcom President and Chief Executive Officer Hock Tan said the company is proud to deepen its decades-long relationship with Apple through the new agreement. He said the investment will enable Broadcom to further expand its manufacturing footprint in Fort Collins while advancing the development of breakthrough technologies that power connectivity solutions used by millions of people worldwide.

The new partnership forms part of Apple’s previously announced commitment to invest $600 billion in the U.S. economy over the next four years. The broader investment strategy spans advanced manufacturing, semiconductor production, research and development, infrastructure, workforce development and job creation, with the goal of reinforcing America’s position as a global leader in technology innovation.

By significantly increasing domestic chip production and investing in next-generation semiconductor technologies, Apple and Broadcom aim to strengthen the resilience of the U.S. supply chain while supporting economic growth, creating skilled employment opportunities and accelerating innovation across the country’s technology sector.

Tags: American JobsAppleBroadcomChip ManufacturingCustom SiliconFort CollinsHock Tansemiconductor industrysemiconductor supply chainSilicon Supply ChainTechnology InvestmentTim CookU.S. EconomyU.S. Manufacturingwireless connectivity
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